Technical specifications

model	FUNMAT PRO 410
PRINT TECHNOLOGY	Fused Filament Fabrication (FFF)
BUILDING VOLUME	305×305×406mm
BUILD PLATFORM	PI sheet heater + ceramic glass
THE BUILDING PLATE	Automatic leveling
LAYER THICKNESS	0.05-0.5mm
PRINT SPEED	Max. 300mm/s
JET	double nozzle
EXTRUDER TEMPERATURE	Max 500℃
BUILD PLATFORM TEMPERATURE	Max 160℃
INSTALLATION SPACE TEMPERATURE	Max 90℃
FILAMENT CHAMBER TEMPERATURE	Max 70℃
SUPPORTED FILE FORMATS	STL, OBJ
FILAMENT DIAMETER	1.75mm
POSITIONAL ACCURACY	XY: 16µm Z: 1.6µm
SMART MONITOR & CONTROL	Filament Jam Alert, Filament Absent Alert, Power Loss Recovery
SAFETY CERTIFICATION	FCC and CE
CONNECTIVITY	WiFi, Internet, USB
SUPPORTED FILAMENTS	PEEK, PEEK+CF, PEKK, ULTEM (PEI), PPSU, PC, PC Alloys, PA, PA+CF, ABS, Carbon Fiber-Filled, Metal-Filled, Fiberglass-Filled, ASA, PETG, ESD-Safe, HIPS , TPU, PLA, PVA, etc.

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