Technical specifications

model FUNMAT PRO 410
PRINT TECHNOLOGY Fused Filament Fabrication (FFF)
BUILDING VOLUME 305×305×406mm
BUILD PLATFORM PI sheet heater + ceramic glass
THE BUILDING PLATE Automatic leveling
LAYER THICKNESS 0.05-0.5mm
PRINT SPEED Max. 300mm/s
JET double nozzle
EXTRUDER TEMPERATURE Max 500℃
BUILD PLATFORM TEMPERATURE Max 160℃
INSTALLATION SPACE TEMPERATURE Max 90℃
FILAMENT CHAMBER TEMPERATURE Max 70℃
SUPPORTED FILE FORMATS STL, OBJ
FILAMENT DIAMETER 1.75mm
POSITIONAL ACCURACY XY: 16µm Z: 1.6µm
SMART MONITOR & CONTROL Filament Jam Alert, Filament Absent Alert, Power Loss Recovery
SAFETY CERTIFICATION FCC and CE

CONNECTIVITY		 WiFi, Internet, USB
SUPPORTED FILAMENTS PEEK, PEEK+CF, PEKK, ULTEM (PEI), PPSU, PC, PC Alloys, PA, PA+CF, ABS, Carbon Fiber-Filled, Metal-Filled, Fiberglass-Filled, ASA, PETG, ESD-Safe, HIPS , TPU, PLA, PVA, etc.